SEMI (Semiconductor Equipment and Materials International) forecast that Taiwan semiconductor industry is expected to grow at twice the rate of the worldwide average of 3.4% in 2015 and 2016, thanks to strong growth in foundry, DRAM (Dynamic Random Access Memory), and OSAT (Outsourced Semiconductor Assembly and Test) sectors. Major investment areas for foundries are 14nm/16nm capacity build-up and introduction of 10nm or more advanced technologies. Meanwhile, DRAM makers have put the migration to 20nm technology front and center in their development plans. OSAT vendors are spending heavily on advanced packaging technologies, such as wafer level packaging, copper pillar bump, and SiP (System in Package). Overall, Taiwan semiconductor industry's front-end fab investment is projected to reach US$12 billion in 2015 and 2016, said SEMI.